Benefits pulled from the full job description
401(k) 401(k) matching employee discount health insurance health savings account tuition reimbursement
At boeing, we innovate and collaborate to make the world a better placeFrom the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared valuesWe’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growthFind your future with us.
Are you up for the challenge? do you want free money in your 401k? do you want job security and a company that invests in you? you need to check us out!
In this exciting role you will lead the innovation and development of novel 2.5d / 3d advanced packaging for high-speed/mixed signal/rf microelectronics applications inclusive of electrical performance of both active and passive elements, thermal-mechanical performance and design for manufactability and reliability.
Along with competitive salaries and our comprehensive benefits, we offer:
Employee performance incentives
Ongoing training opportunities
Boeing employee discount program
Health insurance opt-out incentives
Generous 401k contribution – 10% contribution (not a match)
Student debt payoff
Up to $30k tuition assistance
Professional development program
Every day, boeing intelligence & analytics supports global missions by building and delivering intelligence, analytics, and cyber solutions that enable users to advance national securityWe have provided our customers with the tools needed to counter evolving global and cyber threats, and to improve wartime decision makingOur talented employees bring software development, systems engineering, and advanced analytics expertiseWe offer numerous prime contract opportunities with customers headquartered in maryland, virginia, and the district of columbia, as well as subcontract opportunities that align with our areas of focus and additional opportunities nationwide through our parent company.
What you will do (day in the life):
Lead analysis of customer and system requirements, development of architectural approaches, and detailed specifications for various electronic products
Lead reviews of testing and analysis activity to assure compliance to requirements
Lead activities in support of supplier management with make/buy recommendations and other technical services
Coordinate engineering support throughout the lifecycle of the product
Resolve complex issues on critical programs related to architectural approaches, requirements, specifications and design
Lead technical aspect of proposal preparation
Identify critical performance measures and develops processes for computing them.
Develop new concepts for future product designs to meet projected requirements
Boeing intelligence & analytics (bi&a) is seeking an experienced microelectronics packaging engineer to join their team.
Work location: huntington beach, ca
Telework availability: this position allows for a hybrid work arrangement which is a combination of remote and on site work, generally includes routinely working virtually one or more days per week, schedules may vary by week depending on need to be on-site for test activities and/or for access to closed areas.
Basic qualifications (required skills/experience):
Bachelor`s, master`s or doctorate of science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry
10+ years of experience in the field of microelectronics packaging including mcm, heterogeneous integration, 3d chip stacking, etc
Understanding of impacts of complex packaging architectures on circuit performance including speed, thermal, etc
Experience with swap-c constrained electronics development
Demonstrated track record as a self-motived, independent, high-performance team member
Excellent verbal and written communication ability
Preferred qualifications (desired skills/experience):
Understanding and experience with design, development and testing of advanced packaging techniquesThis includes conventional packaging techniques like asic, bga, 2.5d / 3d heterogeneous integration, and familiarity with commonly available supply chain for fabrication, assembly, packaging and test of multi-chip-modules (mcms) and system-in-package (sip) for digital and rf products.
Understanding of 3dic development flow and tools; chip-level and substrate requirements, architecture, design, and verification; foundry interface and fabrication; and final characterization and test including electrical, mechanical and thermal considerations.
Understanding of commercial microelectronics fabrication process technologies, including standard substrates (organic, silicon and glass) and pcb manufacturing processes
Experience with industry standards for high-speed interconnects
Hold patents in advanced microelectronics packaging architectures and performance improvements
Experience working building and managing outsourced assembly and test (osat) vendor supply chain
Experience organizing and leading cross-functional engineering teams including internal and external organizations
Experience supporting proposals (technical, cost, and schedule) with advanced microelectronics packaging content
Experience with technical, cost, and schedule management
Experience supporting military programs including engagement with customers
Active security clearance
Typical education/experience: education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.gBachelor) and typically 9 or more years` related work experience or an equivalent combination of technical education and experience (e.gPhd+4 years` related work experience, master+7 years` related work experience)In the usa, abet accreditation is the preferred, although not required, accreditation standard.
Boeing intelligence & analytics benefits:
Employees are more effective on the job when they are not distracted by health and financial worriesTo support our workforce, we offer a wide variety of health, life and other insurance benefits (as described above) that allow each employee to choose the coverage best suited to their needs and the needs of their family.
Bi&a is an equal opportunity employerAll qualified applicants will receive consideration for employment without regard to race,color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
Equal employment opportunity is the law (pdf)
Equal opportunity employer:
Boeing is an equal opportunity employerEmployment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.
Posted 30+ days ago